Cadence于2016年1月20日发布了其仿真产品Sigrity的最新版本Sigrity 2016，更新了serial link仿真流程，增加对USB 3.1的支持，对电源完整性的仿真做了优化.

Cadence expanded its Sigrity™ technology portfolio with new products and capabilities:

• Upgraded serial link analysis flow
• Optimized design flows
• Upgraded 3D interconnect modeling
• Upgraded serial link analysis flow to accelerate the time to pass compliance tests 
  • New IBIS-AMI model building technology takes industry-proven equalization algorithms and provides a wizard-based graphical interface to rapidly facilitate creation of IBIS-AMI models. Available in two tiers, one that enables creation of models strictly for Sigrity tools, and another that creates models suitable for any IBIS-AMI compliant simulator.
  • New cut-and-stitch model extraction technology allows for segmenting long serial links into sections that should be modeled using 3D full-wave and sections that can be modeled using hybrid extraction technology. The resultant model is extracted 10X faster than a strictly 3D full-wave extraction with 95% accuracy.
  • New USB 3.1 (Gen 2) compliance kit to confirm that the 10Gbps interface requirements are met.
    • Sigrity SystemSI™ technology
    • Sigrity PowerSI® technology
    • Sigrity PowerSI 3D EM Extraction Option
• Optimized design flow between PCB designer and power integrity engineer
  • New cross-probing between DC analysis report file and Allegro® editing canvas
  • Batch DC analysis available directly from the Allegro editing canvas
  • Review previously generated DC analysis report files from the Allegro editing canvas
    • Sigrity PI Base
    • Sigrity PowerDC™ technology
• Optimized design flow between IC package designer and characterization engineer
  • Batch electrical performance assessment (EPA) available directly from the IC package designer’s editing canvas
  • Batch package model creation using hybrid solver technology directly from the IC package designer’s editing canvas
  • Review previously generated EPA report data from the IC package designer’s editing canvas
    • Sigrity XtractIM™ technology
• Upgraded 3D interconnect modeling to enable rapid modeling of low-cost PCB and IC packages
  • New rapid and accurate capacitance extraction technology
  • Quickly produce RLCG interconnect models for designs with few (or no) power and ground planes/shapes using new 3D quasi-static extraction technology
    • Sigrity PowerSI 3D EM Extraction Option